e-TECHNIPOL^®PA have been specifically developed as 1K solution for an excellent protection of print circuit board PCB and electronic components.

Copolyamide hotmelts e-TECHNIPOL^®PA are characterized by high flexural modulus, superior resistance at low temperature and excellent adhesion to metals and polar plastic substrates. In addition, several grades e-TECHNIPOL^®PA are classified UL94-V0.

Thanks to their intrinsic properties, e-TECHNIPOL^®PA can be processed with melters, low pressure molding, potting and overmolding.

The renewable source content up to 80% and the processing in a solvent-free environment makes e-TECHNIPOL^®PA a sustainable solution for electronic devices.

e-TECHNIPOL^®PA 7115 is a hotmelt adhesive specifically designed for Heat Shrinkable Tubing and Heat Shrinkable Sleeve production. It is characterized by high viscosity, low softening point and very good flexibility, with an excellent adhesion on non-polar substrates as PE. It shows very high resistance to physical curing processes of PE and to expansion/shrinking operations.